4th Int. Conf. on Manufacturing Engineering and Process

Memo

2015 The 4th International Conference on Manufacturing Engineering and Process (ICMEP 2015)

Paris, France, April 13-14, 2015

http://www.icmep.org/

2015 The 4th International Conference on Manufacturing Engineering and Process (ICMEP 2015) will be held in Paris, France during April 13-14, 2015. Science and Engineering Insititute host this conference annually. This conference is a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Manufacturing Engineering and Process. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.

1. Call For Paper



Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:

Advanced Materials Engineering and Technology

Applied thermodynamics, heat transfer, energy conversion

Electronics and Integrated Circuits, Embedded Technology and Applications

Electrical Engineering and Electric Machines

Engineering design and graphics

Instrumentation and measurement Technologies

Manufacturing and Industrial Engineering, Management Applications

Mechatronics and control theory

Modern Control, Automation and reverse engineering

Mathematics - in particular, calculus, differential equations, statistics, and linear algebra

New Technology, Method and Technique in Civil Engineering

Power System and Energy Engineering, Its Applications

Robotics and Its Applications

System Design, Modelling, Simulations and Optimization

Data and Intelligent Information Processing, Its Applications

Signal and Acoustics Acquisition and Processing

Information Technologies and Networks: Its Applications



2. Submission Method

1. Full paper (presentation & publication) please submit the paper via Electronic Submission System or email: This email address is being protected from spambots. You need JavaScript enabled to view it..

2. Abstract (presentation only), please send the abstract to conference email: This email address is being protected from spambots. You need JavaScript enabled to view it..

3. Important Date

Submission Deadline Before December 05, 2014

Notification Date On December 25, 2014

Registration Deadline January 15, 2015

4. Venue

Hotel Novotel Paris Creteil le Lac

http://www.novotel.com/gb/hotel-0382-novotel-paris-creteil-le-lac/index.shtml

5. Committee

International Advisory Committee

Assoc. Prof.You-Jin Park, Chung-Ang University, Korea

Prof Luigi Benedicenti, Software Systems Engineering, Regina, Canada

Prof. Philippe CASTAGLIOLA, Inst. Univ. de Technologie de Nantes, France

Prof. Alain Bernard, Ecole Centrale de Nantes, France

Prof. Joost Duflou, Katholieke Universiteit Leuven, Belgium

Conference Chair

Prof. Bale V. Reddy, University of Ontario Institute of Technology (UOIT), Canada

Prof. Michel Cotsaftis, LACSC/ECE, Paris, France

Program Chair

Prof.MOGNOL Pascal, IRCCyN, Ecole normale supérieure de Rennes, France

Dr.Alexey Vereschaka, Moscow State Technological University STANKIN, Russia

Associate Professor Francisco Ortin, Computer Science Department of the University of Oviedo Spain, Spain

Associate Professor.Dr.Balan D. George, German-Romanian University of Sibiu, Romania

Pro.Bor-Jang Tsai, Chung Hua University Taiwan

Asst. Prof.Mário S. Ming Kong, University Lisbon, Portugal

Technical Committee

Prof.Ting-Chuen Pong, Hong Kong University of Science and Technology, Hong Kong

Dr. Santoso Wibowo, Central Queensland University, Australia

Prof. S. E. Oraby, PAAET, Kuwait

Assoc. Prof Kittisak Kerdprasop, Suranaree University of Technology, Thailand

Prof.Mehmet Savsar, Kuwait University, Kuwait

Prof. Yasuhide Mochida, Graduate school of Science & Engineering, Ritsumeikan University, Japan

Asst. Prof.Sureerat Polsilapa , Kasetsart University, Thailand

Dr. Manish A. Kewalramani, Abu Dhabi University, UAE.

Dr. YIP Mum Wai, Department of Mechanical Engineering, Tunku Abdul Rahman University College, Malaysia

Assoc. Prof Dr.Yusri Yusof, Faculty of Mechanical and Manufacturing Engineering , Universiti Tun Hussein Onn Malaysia

Dr. Burra.Venkata Durga Kumar, Binary University, Malaysia

Prof Nittaya Kerdprasop, Suranaree University of Technology Thailand

Dr Nazri Kama , Advanced Informatics School, Universiti Teknologi Malaysia

Prof.Saad M. Darwish, computer science, Alexandria university, Egypt

Asst. Prof. Mahdi Alajmi, College of Technological Studies, PAAET, Kuwait

Assoc. Prof. Supakorn Pukird, Ubon Ratchathani University, Thailand

Dr. Nico Hanenkamp, Freudenberg NOK Sealing Technologies Plymouth/MI/USA

Prof. Renjun PEI, Columbia University, USA

Dr.Shadi Banitaan, North Dakota State University Fargo, ND, USA

6. Publishing

Selected and registered papers will be published by Applied Mechanics and Materials Journal.(ISSN: 1660-9336).

Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc. (Quoted from TTP offical website:http://www.ttp.net/1660-9336.html)



http://www.icmep.org/