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3rd Int. Conf. on Solid-State and Integrated Circuit

3rd Int. Conf. on Solid-State and Integrated Circuit

ICSIC

Date of beginning

Wednesday, 01 July 2015

Duration

2 days

Deadline for abstracts

Wednesday, 15 April 2015

City

Bali

Country

Indonesia

Contact

Ms. Teresa Zhang

E-Mail

This email address is being protected from spambots. You need JavaScript enabled to view it.

Expected participants

0

Participants

0

Memo

TOPICS:

(1) Silicon integrated circuits and manufacturing____

(2) Digital, Analog, Mixed Signal IC and SOC design technology____

(3) Low-power, RF devices & circuits____

(4) IC Computer-Aided –Design technology, DFM____

(5) Silicon/germanium devices and device physics____

(6) Interconnect, Low K, High K and other process technologies____

(7) Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)____

(8) Unconventional and nano-electronics____

(9) Organic semiconductor devices and technologies____

(10) Compound semiconductor devices and circuits____

(11) Displays, sensors and MEMS____

(12) Semiconductor materials and material characterization____

(13) Reliability____

(14) Modeling and simulation____

(15) Packaging and testing technology____

(16) Equipment technology____

(17) Solar cell & other devices for new energy sources____

For more topics: http://www.icsic.org/cfp.html________



Publication:

All accepted papers of ICSIC 2015 will be published by Applied Mechanics and Materials Journal (ISSN: 1660-9336), Indexing: Volumes are submitted for indexing to Elsevier: SCOPUS and Ei Compendex (CPX). Cambridge Scientific Abstracts (CSA), Chemical Abstracts (CA), Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science), Institution of Electrical Engineers (IEE), etc. (quoted from TTP)________



Submission method:

Electronic Submission System; ( .pdf)

http://www.easychair.org/conferences/?conf=icsic2015