3rd International Conference on Antennas, Microwave and Microelectronics Engineering (AMiMi 2026)

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3rd International Conference on Antennas, Microwave and Microelectronics Engineering (AMiMi 2026) July 28 ~ 29, 2026, Virtual Conference https://amimi2026.org/index SCOPE3rd International Conference on Antennas, Microwave and Microelectronics Engineering (AMiMi 2026) will provide an excellent international forum for sharing knowledge andnew research results in all areas of Antennas, Microwave and Microelectronics Engineering. The conference focuses to promote interdisciplinary studies Antennas, Microwave and Microelectronics Engineering. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to these topics only. Topics of interest Antennas, Propagation and Electromagnetic Engineering Antenna Technologies Antenna Theory, Radiation, and Electromagnetic Modeling Microstrip, Printed, Integrated, and On Chip Antennas Wideband, Multiband, UWB, and High Efficiency Antennas Dielectric Resonator Antennas (DRAs) Conformal, Flexible, Wearable, and Textile Antennas Reconfigurable, Tunable, and Active Antennas MIMO, Massive MIMO, and Holographic MIMO Surfaces Phased Arrays and AI Driven Beamforming Millimeter Wave, Sub THz, and THz Antennas Nano Antennas, Plasmonic and Optical Antennas Antenna in Package (AiP) and Antenna on Chip (AoC)   Emerging Paradigms Reconfigurable Intelligent Surfaces (RIS) / Intelligent Reflecting Surfaces Holographic Beamforming and Continuous Aperture Surfaces Electromagnetic Digital Twins for Antennas and Arrays AI/ML Native Antenna Synthesis and Generative EM Design Antennas for 6G, IoT, UAVs, CubeSats, and Autonomous Systems Integrated Antenna Sensor Systems Propagation and Channel Modeling Channel Modeling for 5G/6G, mmWave, Sub THz, and THz Bands Propagation in Complex, Harsh, and Indoor Environments Scattering, RCS, and Electromagnetic Wave Interaction with Materials Propagation for Joint Communication, Sensing and Localization (JCSL / ISAC) Semantic and Goal Oriented Communication Models Microwave, Millimeter Wave and THz Engineering RF, Microwave and mmWave Components Passive Components: Filters, Multiplexers, Couplers, Transitions Active Components: LNAs, PAs, Mixers, Oscillators MMICs, RFICs, and High Frequency Integrated Components RF MEMS, NEMS, and Micro Machined RF Devices Novel Waveguides, SIW, and On Chip Transmission Lines Sub THz CMOS and SiGe RFICs (140–300+ GHz) High Power mmWave and THz Devices RF Packaging, Heterogeneous Integration and Chiplet Based RF Systems   Advanced RF and Microwave Systems Microwave and mmWave Communication and Sensing Systems THz Sources, Detectors, and Imaging Systems Microwave Photonics and Photonic RF Integration Software Defined Radio (SDR) and Digital RF Architectures AI Enabled RF System Design and Optimization Signal Integrity, EMI/EMC, and High Speed Interconnects RF Interconnects for AI Accelerators and Chip to Chip Wireless Links Radar and Sensing Radar Systems, SAR, Automotive Radar, and Imaging Radar Integrated Sensing and Communication (ISAC) Chipsets Remote Sensing for Climate, Environment, and Security Electromagnetic Imaging and Inverse Scattering Applied Electromagnetics and Computational Techniques Computational Electromagnetics (CEM) and Numerical Methods Physics Informed Neural Networks (PINNs) for EM Simulation Foundation Models and Generative AI for EM Design Metamaterials, Metasurfaces, FSS, and EBG Structures Metasurface Based Analog Computing (EM Computing) Electromagnetic Materials and Novel Media Bio Electromagnetics and RF Exposure Modeling Electromagnetic Compatibility (EMC) and Interference Mitigation EM Digital Twins for RF, Antennas and Propagation   Microelectronics, VLSI and Semiconductor Technologies Semiconductor Devices and Fabrication CMOS, FinFET, GAAFET, and Beyond CMOS Devices Device Modeling, Simulation, and Reliability 2D Material Devices (MoS₂, WS₂, Graphene) CNTFETs, TFETs, and Emerging Nano Devices 3D Monolithic Integration (3D IC) Heterogeneous Integration with Photonics and Co Packaged Optics (CPO) Cryogenic Electronics (Cryo CMOS) for Quantum Computing Advanced Lithography, Nanofabrication, and 3D Integration Organic, Flexible, and Wearable Electronics Circuits and Systems Analog, RF, and Mixed Signal ICs Low Power and Energy Efficient VLSI High Speed Digital and SerDes Circuits System on Chip (SoC), Lab on Chip, and Heterogeneous Integration Memory Technologies: SRAM, DRAM, MRAM, ReRAM, FeFET AI Accelerators and Hardware for Generative AI Neuromorphic Computing and In Memory Computing (IMC) In Sensor Computing and Edge Intelligence   Design Automation and Hardware Security EDA Tools, Mixed Domain Simulation, and Co Design Logic, Architectural, and System Level Synthesis Hardware Security, PUFs, and Side Channel Attack Mitigation Testing, Design for Testability (DFT), and Reliability Engineering Sensors and Microsystems MEMS/NEMS Sensors and Actuators RF MEMS for 5G/6G and High Frequency Systems Micro Sensors for Biomedical, Environmental, and Industrial Applications Bio Integrated RF Systems and Wireless Neural Interfaces Wireless Communication Systems and Emerging Technologies 5G/6G Wireless Systems and Architectures Spectrum Above 100 GHz and Sub THz Communications IoT, Massive IoT, and Low Power Networks UAV to Everything (U2X) and Aerial Networks Non Terrestrial Networks (NTN): Satellite to Phone, HAPS, Inter Satellite Links RFID, NFC, Wireless Power Transfer, and Energy Harvesting Far Field and mmWave Wireless Power Transfer (WPT 2.0) AI Enabled Wireless Networks and Resource Optimization Semantic and Goal Oriented Communications Integrated Localization, Mapping and Communication (JCSL) Wireless for Robotics, Autonomous Systems and RF Based Perception   Sustainability, Security and Cross Disciplinary Innovations Green RF, Sustainable Electronics and Low Carbon Semiconductor Processes Secure RF Systems and EM Side Channel Attack Mitigation Hardware Trojans and Secure IC Design Circular Electronics Manufacturing Bio Compatible RF Materials and Implantable Systems Paper SubmissionAuthors are invited to submit papers through the conference Submission System by April 25, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of nde conference will be published by International Journal on Cybernetics & Informatics (IJCI) (Confirmed). Selected papers from AMiMi 2026, after further revisions, will be published in the special issue of the following journals International Journal of Microwave Engineering (JMICRO) International Journal of Antennas (JANT) International Journal of Microelectronics Engineering (IJME)   Important DatesSubmission Deadline : April 25, 2026Authors Notification : May 30, 2026Registration & Camera-Ready Paper Due : June 06, 2026 Contact Us Here’s where you can reach us : This email address is being protected from spambots. You need JavaScript enabled to view it. or This email address is being protected from spambots. You need JavaScript enabled to view it.